BGA & Fine-Pitch 0201 SMT PCB Assembly As components shrink to fine-pitch BGA, 0201 and 01005 passives, placement precision becomes critical to product reliability. Our BGA and fine pitch SMT PCB assembly line delivers high density interconnect PCBA with 100% X-Ray inspection and AOI to guarantee solder joint integrity on every board. Key Features Fine pitch 0.35mm BGA, 0201 and 01005 component placement 100% X-Ray inspection of BGA and QFN solder joints AOI and ICT combined
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